ESD Characterisation according to HBM, MM, TLP, VF-TLP, HMM und CDM Standards

Manual or automatic precision characterization of ESD Effects on integrated circuits according to international standards

The term ESD stands for “electrostatic discharge” and means the electrical discharge between two points of high potential difference. What can be observed in the sky as lightning can be generated in a much smaller scale in a lab with a number of different instruments.

Basic testing electric circuits for their immunity against accidental electrostatic discharges (e.g. caused by certain carpets) can be done with very simple tools.


The following testsystems are used mainly in the semiconductor industryto accurately characterize the integrated safety components against electrostatic discharges. In the industry different methods are used to characterize these effects:

HBM: Human Body Model – one of thetwo „required“ methods.

CDM: Charged Device Model – the other „required“ method.

MM: Machine Model. Phased out HBM: Human Body Model - eine der beiden "erforderlichen" Methoden.

CDM: Charged Device Model - die andere "erforderliche" Methode.

MM: Machine Model. Nicht mehr so oft angewendet.

TLP: Transmission Line Testing

VF-TLP: Very Fast TLP

HMM: Human Metal Model.

TLP: Transmission Line Testing

VF-TLP: Very Fast TLP

HMM: Human Metal Model

Our partner Grund Technical Solutions is a well known provider of innovations for the above mentioned tests. Flexible hardware is complemented with feature-rich software. In cooperation with the well-known prober supplier Signatone we are able to supply an advanced solution to test modules or wafers ranging from economic manual to semiautomatic stations for high speed testing.

Product Comparison

 

Pure Pulse

Scorpion

Titan

HBM

4kV, 8kV option

-

16kV

TLP

1kV

30-100ns Pulse Width

2-10ns Rise Time

 

-

-

VF-TLP

750V

1-10ns Pulse Width

100ps Rise Time

Cannot be combined

with other pulsers

-

-

HMM

16kV

-

-

MM

400V

-

-

CDM

-

1kV (2kV uncalibrated)

-

Test at wafer level

-

-

Automated testing

Flying Probes

Semi-Automatic Probe Station

Semi-Automatic Probe

 

-

Bias

Up to 10

-

-

DC Leakage

-

-

Capture waveforms

-

All test models without hardware changes

Upgrades

Pulsers

Bias

-

-

Test packages

Package max pin count

Unlimited

(100mm x 100mm)

Unlimited

(150mm x 150mm)

48

128 option

Form factor

Tabletop + Probe Station

Floor Standing

Tabletop

Dimensions

W x L x H

17.5" x 14.5" x 12.5-24"

44cm x 37cm x 32-61cm

W x L x H

23" x 26" x 48"

59cm x 66cm x 122cm

 

W x L x H

19.5" x 14.5" x 9"

49.5cm x 37cm x 23cm

 

Dimensions of probe station

W x L x H

27" x 30" x 22"

69cm x 76cm x 56cm

-

-